抄録
This paper is presented the results of an experimental and numerical study on the effect of the component packaging density to the cooling of natural air-cooled electronic equipment casings. The experiments have been carried out using a ventilated casing with a variety of the volume porosity coefficient in the casing as well as positions of outlet window and heater. The volume porosity coefficient in the casing was varied from 80% to 100% by placing some obstacles, which were assumed as components in the casing. The results show that even if the volume porosity coefficient becomes larger, the mean air temperature rise in the casing hardly changes. The experimental results were compared with the numerical results. The numerical results were very good agreement with experimental ones.
