熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: D213
会議情報
CMOS構造を有したサブミクロンSiデバイスの熱・電気連成解析(オーガナイズドセッション9 マイクロマシン/電子デバイスにおける伝熱問題)
畠山 友行伏信 一慶岡崎 健
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会議録・要旨集 フリー

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抄録
Numerical calculation of submicron silicon MOSFET with CMOS structure is performed. Conjugate nature of the thermal and electrical behavior in the device is considered, and the lattice temperature is solved as well as the carrier concentration and the carrier temperature. The numerical results show that the electrical interaction with neighboring devices is a little more serious than the thermal interaction. Furthermore, by comparing the results of this analysis with that of previous analysis, which are considered only one silicon MOSFET, the importance of the device analysis considering CMOS structure is discussed.
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© 2004 一般社団法人 日本機械学会
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