抄録
A heat spreader has been widely used for thermal management of electronic systems. It is placed between a small heat source and a large heat sink to enhance the heat transfer from the former to the latter. This paper describes the theoretical study on 45° spreading nagle of the heat spreader. This angle is employed by thermal designers, but its validity has not been verified. Therefore, three-dimensional numerical analysis is performed, and the heat transfer characteristics inside the heat spreader are visualized. Form the numerical results, which are obtained by changing the design parameters of the heat spreader, the applicability of 45° spreading angle is confirmed.
