熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: H122
会議情報
H122 気泡微細化沸騰の高熱流束冷却技術への応用(OS-3:電子機器・デバイスの熱課題(2))
鈴木 康一陳 燕結城 和久
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In highly subcooled boiling of water, micromubble emission boiling, MEB, occurs and the heat flux increases higher than the ordinary critical heat flux. Subcooled boiling is performed for a mixture of water and Ethylene-glycol for practical condition of EV cooling system. MEB is generated stably and the maximum heat flux is 3.0〜3.4MW/m^2 (300〜340W/cm^2) at 198〜208K of wall temperature for 50vol% of Ethylene-glycol and 40K of liquid subcooling under the atmospheric condition. Small hysteresis is observed in boiling curves with microbubble emission. The experimental results show that MEB is effective for a high heat flux cooling technology in power electronics.
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© 2013 一般社団法人 日本機械学会
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