熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: H123
会議情報
H123 CPU冷却用ループ型熱サイホン向け沸騰面の性能比較(OS-3:電子機器・デバイスの熱課題(2))
豊田 浩之近藤 義広佐藤 重匡椿 繁裕
著者情報
会議録・要旨集 フリー

詳細
抄録
For energy saving of the servers, we applied the loop-type thermosyphon to CPU cooling. It is necessary to choose the high-performance boiling surfaces to enhance the performance of thermosyphon. Therefore, we have compared the pin-fin and TE-E as high-performance boiling surfaces in condition that they have , been put in real thermosyphon. As a result, the performances of both are equal in the condition that liquid level enough. In addition, they can cool the CPUs in degree of superheat less than half of the flat plate. However, the pin-fin has not worked enough performance in a condition with a little quantity of water.
著者関連情報
© 2013 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top