抄録
The new cooling structure using thermo siphon is developed for network devices. By using our proposed new cooling structure, air flow direction can be optimized corresponding to servers layout. This results in reduction of number of cooling fans as well as energy consumption. In practice, we need to consider to cool multiple control circuit boards. In this study, we utilized four heaters responding control circuit boards. From our experimental results, we observed placing heaters close to the radiator located at the downstream position provides the best cooling performance.
