抄録
Heat transfer from electronic equipment with high packaging density or electric equipment with highly heated portions, not only heat conduction, convection, and thermal radiation but also thermal contact conduction is also involved, and those modes are coupled intricately. In order to make reasonable thermal countermeasure and design of such equipment, it is important to predict the thermal contact resistance accurately. In this study, the thermal contact resistance of solids with wavy rough surfaces has been investigated theoretically and experimentally under the low mean contact pressure of 0.1MPa to 1.0MPa.
