抄録
This paper describes a study on natural convective cooling in electronic casing with outlet. In recent years, heat generation density in electronic devices has been becoming significant due to miniaturization and high performance. High density packaging does not allow to include cooling fan because of insufficient space, and natural convective cooling becomes important for development of electronics. In this paper, fundamental natural convective cooling ability in electronic casing with outlet is discussed by using CFD analysis. As a result, higher cooling ability can be obtained with increase in the distance between heat source and outlet.
