基板上の実装された電子部品の発熱量測定

抄録

Three dimensional numerical analysis is utilized for thermal design of electronic devices. In this calculation, heat productions of electronic component are needed for input values, and they have an important consequence for prediction accuracy. But, it is often the case that the values are imprecision, because it is not well defined to measure or calculate the values at the moment. We developed a measurement method that is used a heatsink with cooling fan and a heat flow sensor. A heat production for a top of the electronic component is measured by the heat flow sensor. Total heat productions are calculated according to a correction algorithm. This measurement is executed in the state that electronic circuit is operated.