電界印加によるサブクール沸騰熱伝達の促進とCHF予測式

抄録

This study has been investigated the development of a high heat-flux cooling device. The subcooled flow boiling performance of a dielectric liquid (Novec-7000, C₃F7OCH₃) was experimentally characterized. An electrode fabricated with ten 1000 μm slits was placed at 600 μm above a heated surface, and was energized to generate a high electric field in the gap between the heated surface and the electrode. The heat performance of the heated wall surface was evaluated at various electric fields (0, 1.6, -3.3, -5.0 kV/mm ), inlet flow rates (1.83, 3.33, and 4.83 g/s), and subcooling temperatures (5, 9, 15, 25 K). A predictive equation derived from the sensible and latent heats successfully predicted the experimental results.