抄録
The mechanical properties of copper thin films formed by cold-rolling and electroplating were compared using tensile test and nano-indentation. Both the Young's modulus and tensile strength of the films varied drastically depending on the microstructure of the films. The Young's modulus of the electroplated thin film is about a fourth of that of bulk material. The micro structure of the electroplated film was a columnar structure of a few hundred-μm wide and polycrystalline.
