論文
光学的手法による微細構造体の面内変位計測
2004 年 70 巻 4 号 p. 517-521
詳細
2004 年 70 巻 4 号 p. 517-521
In this paper, a novel method for measuring nanometer order in-plane displacement of mechanical element in MEMS device will be proposed. Present method is based on the measurement of reflected light intensity irradiated on the edge of measuring target, where the work stage is traversed in the direction of displacement of the mechanical element, under applying AC vibration parallel to the direction of displacement of the element. By applying this method, measurement of displacement under 10 nm can be achieved.
