精密工学会誌論文集
Online ISSN : 1881-8722
Print ISSN : 1348-8724
ISSN-L : 1348-8716
論文
無酸素銅材の表面に及ぼす希薄NaCl電解水の影響
佐藤 運海竹ノ内 敏一若林 信一佐藤 元太郎
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2006 年 72 巻 12 号 p. 1499-1504

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This paper describes the elucidation about influence of dilute NaCl electrolytically water on the surface of oxygen-free copper material. First, by the immersing experiment, it clarified an etching performance to the oxygen-free copper surface of electrolytically oxidized water, electrolytically reduced water and HCl solution. At the same time, the relation between the specific value of electrolytically oxidized water and etching speed of the oxygen-free copper was clarified too. Next, it made the influence which electrolytically water and HCl solution give the shape of the oxygen-free copper surface using SEM and laser 3D image clear. Lastly, by Auger electron spectroscopy, electrolytically water made an influence over the chemical composition of the oxygen-free copper surface layer and so on clear. By above mentioned experiment reviewing, it got the conclusion that dilute NaCl electrolyzed water can be used for surface treatment of the removal of the oxide film and so on in the surface of the oxygen-free copper.

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© 2006 公益社団法人 精密工学会
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