2006 年 72 巻 12 号 p. 1499-1504
This paper describes the elucidation about influence of dilute NaCl electrolytically water on the surface of oxygen-free copper material. First, by the immersing experiment, it clarified an etching performance to the oxygen-free copper surface of electrolytically oxidized water, electrolytically reduced water and HCl solution. At the same time, the relation between the specific value of electrolytically oxidized water and etching speed of the oxygen-free copper was clarified too. Next, it made the influence which electrolytically water and HCl solution give the shape of the oxygen-free copper surface using SEM and laser 3D image clear. Lastly, by Auger electron spectroscopy, electrolytically water made an influence over the chemical composition of the oxygen-free copper surface layer and so on clear. By above mentioned experiment reviewing, it got the conclusion that dilute NaCl electrolyzed water can be used for surface treatment of the removal of the oxide film and so on in the surface of the oxygen-free copper.