抄録
This paper investigates thermal behavior of microprocessor with chiplets. Targeting desktop PC’s and server microprocessors
with 2D based chiplet implementation, effects on junction temperature by thermal conductivity variation of materials used in
microprocerssor package and its heat transfer paths are discussed, especially, focusing on TIM (Thermal Interface Material).
Thermal resistance variation by TIM thermal conductivity is explored and is discussed with thermal network with component
thermal resistance, thermal spreading resistance and thermal local resistance.
