抄録
This study aimed to investigate the formation of three-dimensional structural films by plating and dealloying from a Cu-Ni alloy
plating solution by controlling potential. Additionally, the adhesion of bisphenol A epoxy resin to the three-dimensional structural
films was evaluated. Following the adhesion test, the fracture surfaces were observed and the failure modes were analyzed to
evaluate the effect of the formation conditions of the three-dimensional structural films on the adhesive strength. From the surface
observation, the film formed by plating under －1.0 V potential was found to form spherical structures with a maximum diameter of
10 μm on the surface. Furthermore, the film formed by dealloying under +0.5 V potential was found to form pores with a maximum
diameter of 2 μm at the top of the three-dimensional structures. Cross-sectional observation of the joints revealed that the epoxy
resin filled the spaces between the three-dimensional structures, while no filling of the pores formed by dealloying was observed.
The shear test of the joints showed that the joints with three-dimensional structural films formed under the conditions of －1.0 V and
－1.5 V potentials exhibited high shear strength. It was found that the joints fractured at the interface between the three-dimensional
structural film and Cu plate by observing the fracture surface after the shear test.
