Development of Sintered Silver Interlayer for Low Temperature Bonding on Aluminum with Glass Containing Silver Paste

Abstract

  The silver paste containing glass frit was studied as metal interlayer for Aluminum. On this research, the adhesion tests between glass frit and Al interfaces were demonstrated. From these results, it was revealed that the glass composition to ensure the enough adhesion was determined. In addition, Low temperature die bonding test were demonstrated on the silver layer using Ag₂O paste. As the results, good adhesion between die / Ag bonding layer / Ag sintered layer / Al were obtained on the evaluation of die-shear tests.