抄録
The dynamic compressive fracture of vacuum-evaporated gold films in the thickness range 450 to 3300Å was observed directly in a scanning electron microscope and a transmission electron microscope by mounting the film on uniblock substrates. Electron microscopy observations of heat-treated films showed a wavy type fracture by the dynamic compressive-type strain. This fracture propagation was clearly observed in regions of circular convex domes (3-50 μm diam.) and holes. The distribution of slip within the fracture tip plastic zone was markedly dispersed. The fracture strain increased with increasing film thickness, the greatest increase occurring above 3000Å. The fracture strain ratio (εdεs) of dynamic and static fracture gold films thicker than about 2000Å was usually of the order of 1.1 to 2.4.