Host: The Japan Society of Vacuum and Surface Science
While the miniaturization of semiconductor devices is now approaching the atomic-scale limit, the demand for higher performance of computer chips is ever growing, which has driven new device technologies such as three dimensional structures and new materials. This trend also demands further innovation in process technologies, especially plasma process technologies. In this work, the latest process technologies and numerical simulation technologies that facilitate a better understanding of the underlying physical/chemical mechanisms of the new processes will be reviewed and discussed.
