Host: The Japan Society of Vacuum and Surface Science
The advance semiconductor fabrication, in which circuits are fabricated in nanometer scale, is constantly engaged in battles against nanometer-sized contamination / defects. The further evolution of the processes are supported and facilitated by understanding of its underlying mechanisms, a thorough improvement of reaction uniformity, and ultraclean technology. Focusing on semiconductor wet cleaning and CMP (Chemical Mechanical Polishing), which is fighting with nano-contamination / defects, the mechanism and advanced technology are reviewed in perspective of surface science.
