DUV excimer laser processing for semiconductor package

Abstract

Recently infrared/UV laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer/Panel Level Package and Through Glass/Fused silica Via hole for 5G tele communication and high-performance PC. In this study, we have investigated ablation rate with deep ultraviolet excimer laser to explore its possibilities of micromachining on organic and glass/fused silica interposers.We have succeeded 3um holes on organic film aspect ratio >2 and 10 um hole aspect ratio >50 on glass/fused silica interposer without any significant defects. DUV Excimer lasers could be expected on manufacturing process for next generation semiconductor packages.