Host: The Japan Society of Vacuum and Surface Science
High cleanliness is necessary for copper parts used in particle accelerators that require an ultra high vacuum environment. Therefore, precision cleaning is generally performed after electro polishing or chemical polishing. In this study, we evaluated the cleanliness of chemical polished and precision cleaned copper (C1020) by quantifying the amount of inorganic and organic residues form ion chromatography and gas chromatography mass spectrometry measurements. As a result, a high level of cleanliness was confirmed, which is below the allowable level of residual ions and organic materials for copper in the semiconductor industry.
