In the packaging design of electronic devices, the reliability margins for each design specification have been reduced because of high-quality specifications. Therefore, at an early stage of design, it is important to analyze various design margins such as signal integrity, cooling characteristics and thermal fatigue life of solder joints for a number of design solutions, taking into consideration the element of uncertainty in the design. In this paper, the Response Surface Method (RSM), the First Order Reliability Method (FORM) and Structural Equation Modeling (SEM) were introduced in order to realize the reliability evaluation and optimization in the multidisciplinary design. This method was applied to the packaging design of CPU (Central Power Unit) module for the purpose of the validity verification.
