接合用ボール形成時の被覆線内温度分布のシミュレーション

抄録

To keep pace with multipin semi-conductors or high-density circuit boards, the automated bonding technique for very fine insulated wires is required. One of the important subjects needed to be solved is to prevent the thermal damage of the insulation when a ball for bonding is formed. By computer simulation using the finite element method, we have found that cooling by heat conduction through a metal chuck held near the ball, or forming a ball in a short time is extremely effective.