マトリックス型ダイヤモンドホイールの研削性能に及ぼす砥粒と結合剤の組み合わせの影響

抄録

This paper reports a study on the grinding performance of various wheels with different types of bond materials and diamond grains. Both moderate and aggressive grinding conditions are adopted in this study. Under the moderate grinding condition, grain rotation motion is observed in resinoid-bonded diamond wheels during the grinding process. This motion contributes to a reduction in the grinding force. Based on this finding, grain rotation motion is introduced as a new self-sharpening mechanism of resinoid-bonded diamond wheels. Also, attritious wear is found to dominate the wear process of all kinds of diamond wheels. Under the aggressive grinding condition, four typical wear types are found, with each corresponding to a specific combination of bond materials and diamond grains. It appears that the tearing off or macro-cracking of grains dominates the wheel wear process when the wheel grades are low ; but micro-chipping or attritious wear plays a decisive role when the wheel grades are high.