Abstract
In order to avoid the biological toxicity of 2-ethoxyethyl acetate, a conventional casting solvent for positive photoresists, it was substituted by related ester solvents, and the influence of casting solvents on the resist properties was discussed. The relationship between resin content and viscosity of casting solutions or between the viscosity and resulting film thickness varied depending on the kind of solvent. As a result, these factors gave distinct influence on the resist sensitivity. Thermal resistance of the resists was clearly affected by the resist pattern size, but not apparently by the kind of solvent. The volatility and hydrophilicity of casting solvents seemed to be the key factors to change the resist sensitivity determined at the same film thickness.
