抄録
We have developed a new laser application called laser-assisted resist removal. Laser irradiation far below the ablation threshold can be used to remove a photoresist strongly adhered to a base material (metal or plastic). We employed the second harmonics of Q-switched Nd: YAG laser pulses to irradiate the sample. At an appropriate laser fluence, the photoresist, which transmits the laser light, was detached from the substrate while maintaining its original shape. The technique is not based on laser ablation and therefore no damage is caused to the substrate. Furthermore, it is a dry process that uses neither water nor chemicals, thus preventing the environmental pollution the conventional chemical process produces. Moreover, this method can reduce power consumption and running costs.
