抄録
In this paper, we report a laser cutting process in glass using a pulse CO2 laser. We achieved drilling
micro-through-holes in glass using a transverse-flow pulse CO2 laser with short pulses and verified a
drilling speed of 800 holes per second with a 40-μm diameter. The smallest through-hole drilled in the
glass substrate was a diameter of 25 μm. By continuously connecting the drilled holes, the glass
substrates can be cut into arbitrary forms. We believe that cutting glass with a pulsed CO2 Laser is an
effective processing method.
