スパッタ工程と反応工程を分離した反応性スパッタ

抄録

For optical thin film production by a sputtering method, it is common to use RF or DC reactive sputtering. Since during deposition sputtering and reactive processes are operated simultaneously, a substrate temperature rise is caused. Also the deposition rate is very low because metal atoms sputtered need enough time for sufficient oxidation. For solving these problems, we separated the deposition process into two stages, i.e., sputtering and reactive processes. As result of these two successively separated processes, the deposition rate for metal oxides can be as similar to that of pure metals with no substrate temperature rise. This is completely different from that during RF sputtering. This new type DC reactive sputtering method is called Two Stages High Rate Sputtering, Divided Sputtering Prosess and Reactive process (TSH Sputtering Method). This paper describes the deposition principle and reports the improvements of refractive index, deposition rate and substrate temperature rise. Finally the antireflection coatings produced by the TSH sputtering method as an example of multilayer, and their spectral characteristics and reproducibility are represented.