Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Abstract

The effects of bonding forces and reflow process on the failure behaviors of anisotropic conductive film (ACF) interconnections were analyzed. Conventional reflow process was employed with peak temperatures of 220°C for soldering of Sn-37Pb and 260°C for soldering of Pb-free Sn-Ag or Sn-Ag-Cu. Two kinds of main failure mode were detected after double reflows at 220°C: formation of a conduction gap between conductive particles and Ni/Au-plated Cu pad, and delamination of the adhesive matrix from the plated Cu pad on the flexible substrate. The determination of the failure mode was mainly affected by the variation of the bonding force. The main failure mode of the reflowed ACF joints was conduction gap for the joints with lower bonding forces and adhesive matrix delamination for the joints with higher bonding forces. However, only adhesive matrix delamination was observed after reflows at 260°C. A theoretical calculation was also conducted to predict the connection resistance of the ACF joint before and after reflows. The calculation showed that the optimum bonding forces are between 65 and 70 N.