MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Effect of Plastic Deformation on the Proof Strength and Electrical Conductivity of Copper-Magnesium Supersaturated Solid-Solution Alloys
Yuki ItoHirotaka MatsunagaHiroyuki MoriKazunari Maki
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2014 Volume 55 Issue 11 Pages 1738-1741

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Abstract

The influences of plastic deformation on the proof strength and electrical conductivity of Copper-Magnesium (Cu-Mg) supersaturated solid-solution alloys are investigated and compared to results obtained for pure copper and conventional binary solid-solution copper alloys. Supersaturated Cu-Mg required cold rolling to only a quarter of the equivalent strain (ε = 0.65) of conventional alloys (ε = 2.66) to obtain the same proof strength and electrical conductivity. Furthermore, when cold-rolled to ε = 2.66, Cu-Mg exhibited an electrical conductivity 2.5 times higher than that of conventional alloys, while retaining comparable proof strength.

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© 2014 The Japan Institute of Metals and Materials
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