Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler

抄録

A novel bonding material system and its interconnection mechanism using a Ni-reinforcement particle filled solderable polymer composites (SPCs) with a low-melting-point alloy (LMPA) filler was proposed to enhance the mechanical properties of the SPC joints. To confirm the feasibility of the proposed interconnection mechanism of Ni-reinforcement particle filled SPC, two types of wetting test (e.g., flat and line pattern wetting test) were conducted. The Ni-reinforcement particle filled SPC exhibited better wettability compared with those of SPC without Ni particle. In the microstructure inspection, ternary Cu–Ni–Sn intermetallic compound (IMC) was formed at surface of the Ni particles within the LMPA region and bonding interface between Cu metallization and LMPA. Additionally, the flow, coalescence and selective wetting behaviors of molten LMPA filler was not hindered by incorporated Ni particles.

Fig. 3 Microstructure of the Ni-reinforcement particle filled SPC joint. (a) Ni-reinforcement particle and the IMC layer formed around Ni particle and (b) interfacial microstructure between Cu metallization and LMPA.