Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2010
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Host: Japan Institute of Electronics Packaging

MES2010
The Effect of the Additives in Nickel Plating Film on the Reliability of Solder Joint with the Electroless Ni-P/Au and Ni-P/Pd/Au Plating
*[in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 95-98

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© 2010 The Japan Institute of Electronics Packaging
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