Proceedings of Microelectronics Symposium

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MES2010

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MES2010

Direct Wiring Technology to the Case of Digital Media Products

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 15-18
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_15

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Development of Coated Transparent Conductive ITO Film

[in Japanese], [in Japanese], [in Japanese]

Pages 19-22
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_19

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Development of Transparent Conductive Film by the Use of SnO2-Based Nanoparticle Pastes

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 23-26
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_23

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Effect of Metallization Modification of the Circuit Substrate on the High Temperature Joint Reliability of Power Devices

[in Japanese], [in Japanese], [in Japanese]

Pages 27-30
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_27

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Electrode Bonding of Electronic Devices Using Cu/Sn Multilayer Solid-Liquid Reaction

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 31-34
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_31

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Bondability of Ag Nanoparticles in Pressureless Bonding Process

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 35-38
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_35

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Thermomigration in Lead-Free Flip-Chip Solder Joints

[in Japanese], [in Japanese], [in Japanese]

Pages 39-42
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_39

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The Electromigration Behavior with Respect to the Crystallographic Orientation of Sn Grains in Cu/Sn-Ag-Cu/Cu Ball Joints

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 43-46
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_43

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Influence of Surface Oxide Film of Solder Bump on the Bondability of Flip-Chip Bonding

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 47-50
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_47

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Development of Au-Sn Flip Chip Bonding Technology for Ultra High Speed Mixed-Signal LSI Packages

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 51-54
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_51

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Relation Between Microstructure and Hardness of Sn-low Bi Alloys

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 55-58
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_55

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Fatigue Fracture Properties of Micro Size Sn-Ag-Cu Solder Joint

[in Japanese], [in Japanese], [in Japanese]

Pages 59-62
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_59

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Influence of Reflow Process on Drop Characteristic of Erectrolytic Ni/Au Plating Package

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 63-66
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_63

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Formation Mechanism of Binary and Ternary Eutectic in Lead-Free Sn-Ag-Cu Solder Alloy

[in Japanese], [in Japanese], [in Japanese]

Pages 67-70
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_67

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Effect of Ni Addition on Structure of Sn-Ag-Cu/Cu Solder Joint

[in Japanese], [in Japanese]

Pages 71-74
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_71

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Effect of Controlling Whisker by Phospate Ester in Soldering Flux

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 75-78
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_75

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Study on Solder Whisker Growth and Acceleration Test Method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 79-82
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_79

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High-Density Chip to Chip Bump Connection Technology for 3-D LSI Chip Stacked Integration

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 83-86
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_83

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Development of Connection of High-Density 3D JISSO Cleaning Process by Hydrogen Radical Generated by Hot-Wire Method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 87-90
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_87

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High-Density Room-Temperature 3D Chip-Stacking Using Cone Bumps and Wedge-Incorporated Electrodes

[in Japanese], [in Japanese]

Pages 91-94
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_91

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The Effect of the Additives in Nickel Plating Film on the Reliability of Solder Joint with the Electroless Ni-P/Au and Ni-P/Pd/Au Plating

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 95-98
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_95

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Electroless Ni/Pd/Au Plating for Cu Wire Bonding

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 99-102
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_99

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Aging Effect on the Stress of the Ectroless Plated Ni-P Film by Hydrogen Gas

[in Japanese], [in Japanese], [in Japanese]

Pages 103-106
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_103

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Direct Electroless Copper Deposition on Photolithographic Pattern with Palladium- Nanoparticle Catalyst

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 107-110
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_107

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Adhesion Improvement of Electroless Copper Plating on the Low-Profile Semiadditive PWBs

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 111-114
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_111

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Influence of Electroless Copper Additives to Isolated Circuit on Selective Deposition Ability

[in Japanese], [in Japanese], [in Japanese]

Pages 115-118
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_115

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Copper Oxide and Copper Dissolution Methods for Life Prolongation of Electroless Copper Plating Solution

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 119-122
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_119

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Direct Copper Electrodeposition on Barrier Metal from Ethylenediamine Complex Bath

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 123-126
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_123

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The Effects of Additives on Smooth Copper Foil Fabrication by Electrodeposition

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 127-130
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_127

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Electroless Plating of Ni-and Co-Alloy Using Au Nano-Particles Catalyst and their Application to TSV

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 131-134
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_131

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Direct Metalization for Through Silicon Thermal Via by Using Immersion Plating

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 135-138
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_135

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Advanced Trench Filling Process by Selective Copper Electrodeposition for Ultra Fine Printed Wiring Board Fabrication

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 139-142
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_139

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Effect of Diallylamine System Additives for Copper Via Filling

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 143-146
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_143

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Copper Plating Growth Mechanism of Via-Filling

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 147-150
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_147

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Study on Minute Printed Wiring Board Inspection System

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 151-154
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_151

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Development of Residual Stress Measurement System for Bonded Glass Plates

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 155-158
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_155

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Device Simulation for Stress Effects on nMOSFETs Using an Electron Mobility Model Considering Impact of Shear Stress

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 159-162
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_159

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Mechanical Reliability Characterization of Flip-Chip Packages - Influence of Bulk Modulus in Encapsulating Material -

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 163-166
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_163

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Bonding Strength Evaluation by Using BGA Solder Balls

[in Japanese]

Pages 167-170
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_167

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Estimation of Miniature Solder Specimen’s Creep Atrain by Means of Non-Elastic Constitutive Equations

[in Japanese], [in Japanese]

Pages 171-174
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_171

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Evaluation of Joining Reliability by Using Cu-Cored Solder Balls under Combined Environment

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 175-178
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_175

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Numerical Analysis of Water Cooling Channel for 3D-Packaging

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 179-182
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_179

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Modeling Analysis for Switching Voltage Regulator and Consideration of Capacitors

[in Japanese], [in Japanese], [in Japanese]

Pages 183-186
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_183

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Estimation of Common-mode Current Distribution on Microstrip Line - Investigation by Simulation and Measurement -

[in Japanese], [in Japanese], [in Japanese]

Pages 187-190
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_187

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Examination of EMI Prediction Technique for Digital Device

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 191-194
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_191

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An Antenna Apertured in Metal Housing Wall of Electronic Equipment

[in Japanese], [in Japanese]

Pages 195-198
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_195

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Omni-directional UWB Antenna in Horizontal Plane Built in Electronic Devices

[in Japanese], [in Japanese]

Pages 199-202
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_199

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Fabrication of High-Input-Impedance Circuit and Its Application to the Sensing Technology Using Capacitive Coupling

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 203-206
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_203

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Electro-Mechanical Evaluation of Bio-Interface Material with Self-Restoring Characteristics

[in Japanese], [in Japanese], [in Japanese]

Pages 207-210
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_207

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Improvement of Transmission Characteristics Between Wearable Devices Through the Human Body - Study on Design of Electrode Structure -

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 211-214
Published: 2010
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.20.0_211

CONFERENCE PROCEEDINGS FREE ACCESS

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