Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2012
Conference information

MES2012
Thermal shock test on low-Ag Sn-Ag-Cu-Zn solder
*[in Japanese][in Japanese][in Japanese][in Japanese]
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 159-162

Details
Article 1st page
Content from these authors
© 2012 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top