MES2012
Conference information
Host: Japan Institute of Electronics Packaging
MES2012
Improvement of the accuracy of the nonlinear finite element analyses for a 3D SIC package using the thermal strain measurement with scanning electron microscope and the digital image correlation.
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 163-166
Details
Article 1st page
