MES2012
Conference information
Host: Japan Institute of Electronics Packaging
MES2012
Influence of UBM Layers on Electromigration Behavior of Micro-joints Using Sn-Bi Eutectic Solders
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 171-174
Details
Article 1st page
