Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2013
Conference information

Host: Japan Institute of Electronics Packaging

MES2013
Hybridization of epoxy resin including solder particles with thermoplastic resin film and chip mountability
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 45-48

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© 2013 The Japan Institute of Electronics Packaging
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