Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2013
Conference information

Host: Japan Institute of Electronics Packaging

MES2013
Effect of Resin Properties on Electrical, and Thermal Characteristics of Epoxy/Silver Composite
[in Japanese], *[in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 49-52

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© 2013 The Japan Institute of Electronics Packaging
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