抄録
This paper describes the effects of polyethylene glycol (PEG) derivatives on copper electroplating. α, ω-Diphenylazophenoxy polyethylene glycol (PEG-Az) of the novel PEG derivative provides interesting results, suppressing copper deposition during copper electroplating. We found that PEG-Az suppresses copper deposition without the chlorideion (Cl-ion). To determine the reason for this action, we carried out linear sweep voltammetry (LSV), glow discharge optical emission spectroscopy (GDOES), and electrochemical quartz crystal microbalance (EQCM) measurements for the plating bath containing PEG-Az. PEG-Az was found to be a stronger suppression effect than the PEG even without the Cl-ion.
