抄録
A high-density and slim-type packaging technology in a notebook PC or a handheld PC has been developed as the importance of potability is increased more and more recently. The heat dissipation generated in small-sized electronic units should be made effectively for operating stability during life-time. Considering the technical trend for miniturized packaging of components which requires a very limited space installed in a system,it is inevitable to apply a micro cooling device. In the present study, the performance of thinner cooling unit combined with thin Dual Cooling Jet (DCJ) Piezo fan is investigated. 1 mm thickness flat heat pipe is the main component of the thinner cooling unit. Thin DCJ Piezo fan is used at the condenser for heat dissipation. Because of very small thickness of DCJ Piezo fan compare with conventional DC fan, the thickness of the condenser of the thinner cooling will be reduced significantly when DC fan is replaced with DCJ. In addition to experimental study, theoretical study is done as well to investigate the feasibility of the condenser cooling of thinner cooling module by DCJ Piezo fan. The easibility study shows that by using skive heat sink with very small pitch along the heat pipe length and at both sides of the flat thin heat pipe at the condenser, the problem is feasible when the jet velocity is more than 4 m/s.
