抄録
The mechanical properties of thin films of ceramic materials are useful in the packaging of micro electro mechanical systems (MEMS). For example silicon nitride microclips 3 micrometer thick have been used in silicon optical benches to hold fibres in silicon v-grooves [1]. This paper describes work to enlarge the set of ceramic materials available for MEMS applications. Focused laser micromachining in combination with wet etching of the substrate is used to prototype structures such as microbeams for testing with a scanning profiler to evaluate the properties of new materials. For example 5 micrometer thick chemical vapour deposited silicon carbide has a Youngs modulus 360 +/- 50 GPa, indicating that it is a promising material for mechanical and packaging applications.[1] R. M. Bostock, et.al., J. Micromechanics Microengineering 8, 343 (1998).
