抄録
UBE INDUSTRIES LTD. has developed the non-adhesive type copper clad laminate, “UPISEL®-N”, based on the new polyimide film. UPISEL®-N is formed by the continuous heat lamination of copper foil and the modified polyimide film which has a thermoplastic nature at the surface region. With no use of adhesive, UPISEL®-N maintains high physical properties and high reliability at high temperatures. It performs excellent peel strength, heat soldering resistance, chemical resistance and dimensional stability.
