Low Temperature Curable Photosensitive Dielectric Material with High Resolution

Abstract

Recently, semiconductor package with redistribution layer (RDL), such as fan-out wafer level package (FOWLP), has been developed to achieve downsizing for increasing pin counts and lowering cost. Dielectric material used for FOWLP needs to meet requirements such as low warpage, high reliability and adhesion strength with metals used as RDL. We developed low-temperature curable positive tone dielectric material, AH series, for FOWLP. AH-3000 has low residual stress to suppress substrate warpage, as well as high tensile strength and low CTE for more reliable FOWLP.