Abstract
Laser based direct write exposure tool for advanced semiconductor packaging has been introduced into the market. The tool has unique features compared to existing high-pressure mercury lamp based exposure tools. The tool does not require any masks or reticles because it equips with state-of-the-art light valve called Grating Light Valve (GLV) along with high power laser unit producing wavelength of 355 nm. Minimum resolution that the tool is able to draw is 2μm lines/spaces with overlay accuracy of equal to or less than 1 μm at average plus 3σ, that satisfies most advanced packaging requirement as of today. In the paper, we will introduce the advantage of this type of exposure tool in the market and discuss about technical challenges.
