Low-Temperature Curable Dielectric Materials with Higher Reliability

Abstract

Semiconductor packages with redistribution layers have been necessary with their miniaturization and functionalization. Dielectric materials for the packages require low-temperature curability to avoid thermal damage of devices and thermally unstable materials in the packages, and to keep high reliability for various thermal tests. Low-temperature curable positive-tone photosensitive material AR-5100 was developed and its reliabilities were evaluated. AR-5100 kept mechanical properties after reliability tests. Especially, AR-5100 had good bias HAST tolerance. AR-5100 is capable of adapting to next-generation packages which require high reliability.