Meeting Challenges of Advanced Packaging Designs with a Preimidized Polymer as Dielectric Material

Abstract

This paper describes performance characteristics of a photoimageable dielectric organic polymer. Dielectric material used in this study is a preimidized polyimide (PID). Preimidized polymer cured in the temperature range of 170 ℃ to 230 ℃ shows excellent thermal stability and stable thermomechanical properties in a broad cure temperature range compared to its precursor analog (polyamic acid; PAA). PID also demonstrates excellent adhesion on different substrate types. PID retains good peel strength on copper even after 96 hours of HAST. PID has excellent stability against ion migration under multiple reliability test conditions.