抄録
The effect of pore distribution on the film properties of low-dielectric-constant porous SOG material has been studied. A novel low-dielectric-constant porous material, Interpenetrated SOG (IPS), was designed to have the pore diameter range below 5nm. It is composed of pyrolic template, which is an organic oligomer, and framework made from SOG polymer and Silica sol, and it has an interpenetrated structure. Thermal decomposition of the organic component successfully resulted in films with pore diameter range below 5nm. It is found that the dielectric constant and the pore diameter are affected by the density, and the film strength is affected by average pore diameter. Practically, films with the average pore size below 5nm possessed dielectric constant as low as 2.2 and sufficient strength.
