The Status of 157nm Lithography Development

Abstract

This paper outlines the major challenges for the development of 157nm lithography. Most components are covered including lasers, masks, pellicles, and CaF₂, with special emphasis on resist and contamination issues. In the area of contamination and cleaning, several different types are discussed: lens contamination by resist outgassing, contamination of CaF₂ surfaces, resist contamination, and reticle contamination. The major issues for the implementation of 157nm lithography are pellicles, CaF₂ supply and timing of resist.