Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Fine Pattern Replication by EUV Lithography
Kazuhiro HamamotoTakeo WatanabeHarushige TsubakinoHiroo KinoshitaTsutomu ShokiMorio Hosoya
Author information
JOURNAL FREE ACCESS

2001 Volume 14 Issue 4 Pages 567-572

Details
Abstract

Fine pattern replication utilizing 3-aspherical mirror system settled on NewSUBARU beamline is described. The exposure system is composed of three aspherical mirrors, and the NA is 0.1. The diffraction limited resolution of 60nm was exposed on exposure area of 10mm×2mm. The Cr mask pattern fabricated by the wet etching method was used for the extreme ultraviolet lithography mask. The pattern of 100nm or less can be formed by with this Cr mask, and using photoresist of ZEP520 and SAL601. The line and space pattern width of 60nm was fabricated with ZEP520. In addition, it has been understood that the isolation line of 43nm width was replicated. Furthermore the hole pattern of 150nm was replicated.

Content from these authors
© The Technical Association of Photopolymers, Japan
Previous article Next article
feedback
Top