Proceedings of JSPE Semestrial Meeting
2005 JSPE Autumn Meeting
Session ID : M15
Conference information

Development of New Wire Tool for Multi-wire saw
*Satoshi SakamotoYasuo KondoKenji YamaguchiShiro OzakiNoboru MurakamiNorio Akita
Author information
Keywords: wire tool, wire saw, slicing
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
In a slicing by multi–wire saw, there are two kinds of system, a free abrasive grain system and a fixed abrasive grain system, which have good and bad points. Generally, free abrasive grain system is suitable for precision slicing in low cost, but slicing speed is slow, and also large quantity of industrial waste occurs. On the other hand, fixed abrasive grain system can be high speed slicing, but wire tool is very expensive. Therefore a free abrasive grain system is adopted when forming accuracy is necessary, and a fixed abrasive grain system is adopted when the processing efficiency is necessary. In this study, a half fixed abrasive grain system is proposed, which is located between a free abrasive grain system and a fixed abrasive grain system. Moreover, a trial manufacture result of a proposed half fixed abrasive grain wire tool is reported.
Content from these authors
© 2005 The Japan Society for Precision Engineering
Previous article Next article
feedback
Top